LRF Electronics
ProductHub
Focus on the whole semiconductor memory industry chain, providing one-stop service from chip design
sealed test manufacturing to module sales
Trans-flash Card
Compatible with speed Class 4, Class 6, Class 10, UHS-I, A1, A2, V30, V60, V90 and other standards, support 128MB to 512GB capacity range. Support die process SLC,MLC,TLC,QLC. With small volume, large capacity, high stability, to meet the different needs of users for storage space.
DIP（Dual In-line Package）
Ball Grid Array (BGA) Package A widely-used electronic component packaging technology in modern electronics manufacturing. It connects chips to printed circuit boards (PCBs) via solder balls, delivering high-density integration, enhanced reliability, and superior thermal performance.
Trans-flash Card
Compatible with speed Class 4, Class 6, Class 10, UHS-I, A1, A2, V30, V60, V90 and other standards, support 128MB to 512GB capacity range. Support die process SLC,MLC,TLC,QLC. With small volume, large capacity, high stability, to meet the different needs of users for storage space.
DIP（Dual In-line Package）
Ball Grid Array (BGA) Package A widely-used electronic component packaging technology in modern electronics manufacturing. It connects chips to printed circuit boards (PCBs) via solder balls, delivering high-density integration, enhanced reliability, and superior thermal performance.