Micor SD 尺寸：14.99mm*10.…
LRF Electronics
Powering the Future
Innovating Without Limits
Specializing in the full semiconductor memory industry chain
we deliver one-stop solutions from chip design and packaging/testing to module sales
Driven by R&D innovation
our cutting-edge technologies empower the global storage ecosystem
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Production device application environment
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We are committed to in-depth analysis and solution of various business problems in enterprise operations, through a systematic service process, to provide professional one-to-one consulting services for each customer. Based on the actual needs of customers, combined with industry experience and data insight, we accurately locate pain points and develop practical operational plans, through continuous tracking and feedback mechanism, help customers optimize processes, improve efficiency, and ultimately achieve quantifiable business goals and long-term sustainable development.
Expert Consulting · Targeted Solutions
Drive Sustained Business Leadership
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Compatible with speed Class 4, Class 6, Class 10, UHS-I, A1, A2, V30, V60, V90 and other standards, support 128MB to 512GB capacity range. Support die process SLC,MLC,TLC,QLC. With small volume, large capacity, high stability, to meet the different needs of users for storage space.
DIP（Dual In-line Package）
Ball Grid Array (BGA) Package A widely-used electronic component packaging technology in modern electronics manufacturing. It connects chips to printed circuit boards (PCBs) via solder balls, delivering high-density integration, enhanced reliability, and superior thermal performance.
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Gratitude in Action · Clients at Heart
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